8 automated SMT lines. 01005 to BGA 0.3mm. 3D AOI + X-Ray. IPC Class 3.
| Parameter | Capability |
|---|---|
| SMT Lines | 8 fully automatic lines (Fuji NXT III + Yamaha YSM20) |
| Placement Speed | 0.04s / chip (combined > 8 million placements / day) |
| Minimum Component | 01005 (0.4 × 0.2mm) |
| BGA Pitch | 0.3mm minimum |
| Max Board Size | 510mm × 460mm |
| Component Types | BGA, QFN, QFP, CSP, μBGA, 0201, 01005, PoP, LGA |
| Soldering | Lead-Free (RoHS) / Leaded — Selective soldering available |
| DIP Lines | 4 lines — wave soldering + selective soldering |
| Inspection | 3D SPI + 3D AOI + X-Ray (BGA) + ICT + FCT |
| Conformal Coating | Acrylic, Silicone, Polyurethane — automated spraying |
| Value-Add Services | Box Build, Cable Assembly, Wire Harness, Potting & Encapsulation |
Complete turn-key manufacturing from bare PCB to finished product.
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