Close-up of automated SMT pick-and-place machine head in motion, nozzle tip in sharp focus above PCB pad, industrial blue lighting

About Uppcba

Our Story

Built to Bridge the Gap

Uppcba was founded to fill a persistent gap in the electronics manufacturing landscape: the space between hobbyist-level prototyping services and high-volume mass production. For years, engineering teams with mid-sized projects had nowhere to turn. Prototype shops could not handle thousands of units with consistency, and Tier-1 contract manufacturers would not return calls for anything under a hundred thousand boards. We built Uppcba to be the answer — a professional, certified PCBA facility purpose-built for small-to-medium batch production.

Based in Shenzhen, at the heart of the global electronics supply chain, our team brings together over 20 years of combined engineering experience spanning PCB design, process engineering, quality assurance, and supply chain management. We operate our own SMT and DIP assembly lines under one roof, with zero subcontracting. Every board that leaves our facility has been assembled, inspected, and tested by technicians who are accountable for their own work. This direct ownership of the entire process is what allows us to maintain a 99.7% first-pass yield rate across production volumes ranging from a single prototype to 10,000 units.

Our mission is straightforward: make professional-grade PCBA accessible to companies of all sizes. Whether you are a startup validating your first hardware revision or an established OEM launching a new product line, you get the same production line, the same quality standards, and the same engineer-led DFM review. No minimum order quantity, no gatekeeping, no compromises on quality. Just precision assembly backed by real engineering expertise.

Capabilities at a Glance

Manufacturing Resources

Six core capabilities operating under one roof. No subcontracting, no handoffs, no accountability gaps.

Abstract geometric representation of precision manufacturing — caliper measuring a PCB
6
High-Speed SMT Lines
4
DIP Assembly Lines
Mixed Technology SMT + DIP
0.3mm
BGA & Fine Pitch Capability
Conformal Coating In-House
Box Build & Final Assembly
Our Equipment

Precision Tools for Precision Work

Every production stage is served by industry-leading equipment calibrated to IPC standards.

Abstract geometric representation of a production facility — conveyor line simplified to geometric forms, isometric line-art
Abstract geometric representation of an SMT production line with simplified machine shapes and copper trace-like connecting lines in isometric view
SMT Production Line
75,000 CPH Placement Rate
0.3mm Min BGA Pitch
Yamaha & Panasonic high-speed placement systems with vision-centering on every component. Closed-loop positional feedback on every cycle.
AOI inspection abstraction with camera lens element over PCB and scan lines suggesting automated optical inspection
Inspection & Quality Control
3D AOI Optical Inspection
X-Ray BGA & Hidden Joint
3D automated optical inspection detects solder defects at micron scale. X-ray inspection verifies BGA ball integrity, voiding, and hidden solder joints.
Wave solder abstraction with wave form under board plane and warm metallic tones in isometric line-art style
Through-Hole Assembly
Wave Lead-Free Solder
Selective Precision Soldering
Wave soldering for high-throughput DIP assembly plus selective soldering for mixed-technology boards where SMT components cannot survive wave contact.
Quality Standards

Certifications & Compliance

Every certification is maintained through annual third-party audits. Our processes are built to IPC-A-610 Class 3 as the default standard.

ISO 9001:2015

Quality management system certified by an accredited body. Covers all aspects of our design review, procurement, production, inspection, and delivery processes.

ISO 13485:2016

Medical device quality management certification. Our production environment, traceability systems, and validation procedures meet the stringent requirements for medical PCB assembly.

IPC-A-610 Class 3

The highest industry standard for electronic assembly acceptability. Class 3 requires defect-free performance in high-reliability applications where downtime is unacceptable. This is our default workmanship standard.

UL Certified

Underwriters Laboratories certification for printed circuit board assembly. Our UL recognition covers the full range of assembly processes, ensuring compliance with North American safety standards.

RoHS Compliant

Full compliance with the Restriction of Hazardous Substances Directive (EU 2015/863). Our standard process is lead-free. All materials, including solder paste, flux, and conformal coating, meet RoHS requirements.

Discuss Your Project Requirements

Share your BOM and Gerber files. Our engineering team will review your design and respond with a complete quotation within 24 hours.