ISO-certified SMT, through-hole, and mixed-technology assembly with industry-leading first-pass yield rates. Engineering precision at every node.
Three specialized assembly lines under one roof. From micro-scale SMT to heavy-leaded through-hole, we handle the full complexity spectrum.
We are not a broker. Every board is assembled on our own lines by technicians who inspect their own work. Our process is built around three principles that define every project we take on.
Five precision stages. Every board passes through each gate before it ships. No shortcuts, no skipped inspections.
We analyze your Gerber files, BOM, and assembly drawings. Every pad geometry, thermal relief, and clearance is checked before a single stencil is cut.
Laser-cut stainless steel stencils matched to your pad geometry. Automated solder paste inspection (SPI) verifies deposit volume, area, and height on every pad before components land.
High-speed placement with vision-centering on every component. Our lines handle 0201 passives through 45 mm square QFPs with closed-loop positional feedback on every cycle.
Multi-zone reflow with real-time thermal profiling per board type. Nitrogen atmosphere available for high-reliability applications. Every profile is validated against IPC/JEDEC J-STD-020.
Automated optical inspection catches solder defects at micron scale. Functional testing verifies your board behaves exactly as designed — power-up, signal integrity, full boundary scan where applicable.
Upload your BOM and Gerber files. We respond with a complete quotation within 24 hours.
